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Advanced Materials

"Advanced Materials" is based on solid rocket high-performance material technology. At present, the composite business of special metal materials, photovoltaic thermal field materials and carbon/carbon composites has been formed.
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产品描述

"Advanced Materials" is based on solid rocket high-performance material technology. At present, the composite business of special metal materials, photovoltaic thermal field materials and carbon/carbon composites has been formed.

 

 

1.Molybdenum Copper Microelectronic Packaging Material

-- Basic information --

     Molybdenum copper is a composite material of molybdenum and copper. It has adjustable coefficient of thermal expansion and thermal conductivity. The molybdenum-copper have the low density, high strength, high specific gravity, good conductivity and good process ability. It is more suitable for aerospace, electronic packaging, and communications.

-- Product parapmeters --

-- Application areas  --

     Molybdenum copper material is the preferred material in the field of condutive heat dissipation components used in high-power integrated devices. Molybdenum-copper materials have a certain range of applications in semiconductor technology, high-voltage switch contacts, nuclear technology, and medical systems. 

-- Product advantages  --

1. Molybdenum-copper have better thermal conductivity;

2. Molybdenum-copper are resistant to ablation, and have good conductivity and processability;

3. The content of molybdenum in molybdenum copper is controlled stably, and the coefficient of thermal expansion and thermal conductivity are very stable;

4. Better electroplating quality, good thermal shock resistance; relative density ≥99%, low porosity, better air tightness.

 

2.Tungsten Copper Microelectronic Packaging Material

-- Basic information --

   Tungsten copper is a composite material of tungsten and copper. The main purpose of this material is to use both the low expansion characteristics of tungsten and the high thermal conductivity of copper. By adjusting the different proportions of tungsten and copper elements, the purpose of tungsten-copper materials with suitable coefficient of thermal expansion and high thermal conductivity is achieved.

-- Product parameters --

-- Application areas  --

    Tungsten copper microelectronic packaging materials can form good matching characteristics with ceramic materials, semiconductor materials, and metal materials. Therefore, it is suitable for packaging materials of high-power devices, such as substrates, lower electrodes, etc. high-performance lead frames; thermal control boards and radiators in military and civilian thermal control devices.

-- Product advantages  --

1. Without sintering activation elements, it has good thermal conductivity; 

2. There is no copper enrichment in the product;

3. Good size control, surface finish and flatness;

4. Good electroplating quality, thermal shock resistance;

5. Relative density ≥99%, low porosity and good air tightness.

 

3.Diamond/copper Heat Sink Material

-- Basic information --

     Diamond/copper is a composite material of diamond and copper. It is usually prepared by pressure infiltration process or powder metallurgy process. With the increase in heat dissipation requirements for second- and third-generation high-power semiconductor chip devices such as gallium arsenide (GaAs), gallium nitride (GaN), and silicon carbide (SiC), diamond/copper materials have been widely promoted and applied.

-- Product parameters --

-- Application areas --

     Diamond/copper is currently widely used in semiconductor lasers, microwave power devices, and high-power semiconductor lighting.

-- Product advantages --

1. High thermal conductivity and low thermal expansion coefficient;

2. The composition of diamond and copper can be customized;

3. High processing size precision and strong controllability, effectively improving the surface and corner quality;

4. Better electroplating quality and thermal shock resistance.

 

4.Tungsten Copper Heat Sink  Material for Lasers

-- Basic information --

    Tungsten copper heat sink products are made of a combination of tungsten and copper in a certain proportion. They have both the low expansion characteristics of tungsten and the high thermal conductivity characteristics of copper. Therefore, the tungsten copper heat sink prosucts can be a good heat dissipation auxiliary material for the laser.

-- Product parameters --

-- Application areas  --

      Tungsten copper heat sink products are mainly used in semiconductor lasers of different wavelength bands such as 808nm and 1064nm.It is used in the field of medical cosmetology, such as hair removal and wrinkle removal.

-- Product advantages  --

1. The copper content is evenly distributed and the composition consistency is good;

2. The thermal expansion coefficient of the tungsten copper heat sink materials and the laser chip are well matched;

3. Good size control, surface finish and flatness;

4. Good plating quality.

 

5.Electrical Contact Materials

-- Basic information --

      The powder gold treatment electrical contact materials produced by our company, Tungsten copper and Tungsten Carbide copper are composed of tungsten or tungsten carbide as skeleton, and copper is filled in the pores of skeleton to form composite materials, the high melting point skeleton ensures the contact's compressive strength, resistance to electric corrosion and resistance to fusion welding. 

      Copper not only improves the conductivity, heat conduction and processing performance, but also absorbs a large amount of arc heat when the arc evaporates at high temperature, improvement of service conditions and reduction of electric erosion.

-- Product parameters --

-- Application areas --

    The WCU products includes WCu10 ~ WCU50 alloy contact materials, Cu-W-WC and CU-WC, CUCR contact materials. The products are mainly used in the contact materials of vacuum interrupter of medium and high voltage vacuum load switch, vacuum contactor and circuit breaker.

-- Product advantages --

1. High density, high thermal conductivity, high strength and hardness.

2. Low resistivity, low Coefficient of thermal expansion.

3. Excellent properties such as resistance to arc erosion, resistance to fusion welding and resistance to electrical erosion.

 

6.TC-1840 Mini Triggered Spark Switch

-- Basic information --

   TC-1840 Mini Triggered Spark Switch is a kind of high reliability switching up to 3.5kV and 3KA. Constructed of hermetically sealed ceramic-metal,filled with compressed gas.

   The triggered spark switch has three electrodes. It is pressurized switch that operates in an in-line ignition systems,conducting moderately high peak currents for short duration.Commutation between two main electrodes is initiated by a trigger pulse.

-- Product parameters --

-- Application areas --

      The spark switches are used in aircraft such as rocket motor ignition,warhead detonation and missile stage separation. Each of the applications involves the activation of electro-explosive devices such as:

1. Exploding bridgewire(EBW)

2. Exploding foil-initiator(EFI)

3. Electronic safe and arm(ESA)

4. Slapper/detonator

-- Product advantages --

1. Compact size and light weight.

2. Sturdy and durable.

3. Fast response.

4. It can meet the harsh requirements of the size, switching speed, impact, temperature change and vibration of the rocket working in the harsh environment.

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